Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package

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Mexican Peso
MXN3,115.11
SKU:
9781119793779
Autor:
Keser
Editorial:
Global Research
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Product Overview

Importante: este producto es importado y puede tener una demora de 30 días. 

Titulo: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package

Año: 2021

Autor: Keser

Editorial: Global Research

Lenguaje: 

ISBN: 9781119793779

SKU-INT: WLEY020960

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